Products Details
| GB | T2 |
| UNS | C11000 |
| EN | / |
| JIS | C1100 |
| Copper, Cu Argentum, Ag | Min. 99.90% |
| Sulphur, S | ≤0.005% |
| Iron, Fe | ≤0.005% |
| Plumbum, Pb | ≤0.005% |
| Bismuth, Bi | ≤0.001% |
| Arsenic, As | ≤0.002% |
| Stibium, Sb | ≤0.002% |
| Density | 8.91 g/cm3 |
| Electrical Conductivity | Min. 99.7 %IACS |
| Thermal Conductivity | 391.1 W/( m·K) |
| Melting Point | 1083 ℃ |
| Thermal Expansivity | 17.3 10-6/ K |
CAMK11000 is industrial pure copper with excellent thermal conductivity, corrosion resistance and excellent workability, and is easy to withstand processing such as drawing, riveting, extrusion, winding, deep drawing, and hot forging. There is no "hydrogen embrittlement" under normal conditions, and it can be processed and used under reducing atmosphere conditions, but it is not suitable for processing and use under high temperature oxidation conditions, and the surface will turn purple after an oxide film is formed.CAMK11000 is mainly used as electrical, thermal and corrosion-resistant components, such as electrical industry (conductive caps, automotive conductive accessories), wires and cables, conductive screws, housings and various conduits and aviation industry. | Specification mm (up to) | Temper | Tensile Strength Min. MPa | Yield Strength Min. MPa | Elongation Min. A% | Hardness Min. HRB |
| φ 3-40 | Y | 275 | / | 10 | / |
| φ 40-80 | Y | 245 | / | 12 | / |
| ＞φ 80 | TF00/TB00 | Please send an email to ryan@corammaterial.com for more details. |
1. We actively respond to any questions from customers and provide shorter delivery times. If customers have urgent needs, we will fully cooperate. 2. We focus on controlling the production process so that the performance of each batch is as consistent as possible and the product quality is excellent. 3. We cooperate with the best domestic freight forwarders to provide customers with sea, rail and air transportation and combined transportation solutions, and have plans for transportation difficulties caused by natural disasters, epidemics, wars and other factors.
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